Method of characterization, method of characterizing a...

Details Method of characterization, method of characterizing a... Method of characterization, method of characterizing a...

2004-05-13

2008-08-12

Young, Christopher G (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000, C382S144000, C382S145000

Reexamination Certificate

active

07410735

ABSTRACT:
A system in which deformation of a substrate wafer is monitored during processing of the wafer is disclosed. In one embodiment, the distortion in the substrate wafer is measured after each exposure and processing operation by comparing the position of a plurality of reference marks to values in a database.

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Japanese Patent Application No. 2004/142011, dated Dec. 14, 2007 on Japanese Application No. 2004-142011.

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