Method of centering a lid seal clip

Details Method of centering a lid seal clip Method of centering a lid seal clip

1995-10-04

1997-05-27

Bradley, P. Austin

Metal fusion bonding

Process

Alternative bonding

228212, 228 447, 156292, 156580, 156581, B23K 3704

Patent

active

056324375

ABSTRACT:
A lid is sealed to an integrated circuit package by a method that uses a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The pressure foot is retracted against the spring bias while secondary jig index pins are meshed with corresponding sockets in the fabrication boat that are aligned with the package position on the boat. When the pins and sockets are meshed, the pressure foot is released to apply optimal assembly force at the package center normal of the package lid plane.

REFERENCES:
patent: 2444312 (1948-06-01), Roberds et al.
patent: 4595794 (1986-06-01), Wasserman
patent: 4871106 (1989-10-01), Wharff
Salvadore V. Caruso, et al., "Investigation of Discrete Component Chip Mounting Technology for Hybrid Microelectronic Circuits," N75-25044, National Technical Information Service, Springfield, VA, May 1975.

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