Method of centering a high pressure lid seal

Details Method of centering a high pressure lid seal Method of centering a high pressure lid seal

1995-10-04

1997-12-09

Sells, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156579, 156580, 269238, 269903, B25B 2702

Patent

active

056955936

ABSTRACT:
A lid is sealed to an integrated circuit package by a method that uses a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The pressure foot is retracted against the spring bias while secondary jig index pins are meshed with corresponding sockets in the fabrication boat that are aligned with the package position on the boat. When the pins and sockets are meshed, the pressure foot is released to apply optimal assembly force at the package center normal of the package lid plane.

REFERENCES:
patent: 3775644 (1973-11-01), Cotner et al.
patent: 4669416 (1987-06-01), Delgado et al.
patent: 4875966 (1989-10-01), Perko et al.
patent: 5106451 (1992-04-01), Kan et al.
patent: 5154339 (1992-10-01), Takeuchi et al.
patent: 5465470 (1995-11-01), Vongfuangfoo et al.
patent: 5501436 (1996-03-01), Miller

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