Metal fusion bonding – Process – Preplacing solid filler
Patent
1998-08-07
2000-08-22
Ryan, Patrick
Metal fusion bonding
Process
Preplacing solid filler
22818022, 228 563, B23K 3512, B23K 3100, B23K 3102, B23K 3514
Patent
active
061058513
ABSTRACT:
I/O columns are cast on the I/O pads of an electronic component via a process which uses a template that has a set of alignment holes, and a set of casting holes, and an additional set of pin holes that are interspersed with the casting holes. Initially, the template is placed in a fixture such that the casting holes align with the I/O pads of the electronic component. Next, the template is covered with a mask that exposes all of the casting holes but blocks all of the pin holes. Then the exposed casting holes in the template are filled with a solid metallic material. Next the mask is removed, and the metallic material in the casting holes is melted and re-solidified to thereby form the I/O columns on the I/O pads. Then the electronic component with its I/o columns is separated from the template by pushing on the component with pins that are passed through the pin holes in the template. Since the pin holes are interspersed with the casting holes, the electronic component is pushed away from the mask without bending the template. Consequently, the I/O columns do not bind in the casting holes; and thus they do not break as they pushed from the template.
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Economy Kenneth Walter
Norell Ronald Allen
Fassbender Charles J.
Newsome C.
Ryan Patrick
Samuels Steven B.
Starr Mark T.
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