Method of bump bonding and sealing an accelerometer chip onto an

Details Method of bump bonding and sealing an accelerometer chip onto an Method of bump bonding and sealing an accelerometer chip onto an

1992-05-11

1992-11-17

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, 437213, 437915, 437927, 73517R, 73777, H01L 2156, H01L 2158, H01L 2160

Patent

active

051643286

ABSTRACT:
A method of joining an integrated circuit die (10) and a sensor die (11) by the use of solder bumps (12) for the formation of a hybrid circuit assembly. Sensor die (11) and integrated circuit die (10) are manufactured separately from each other. These two components are then joined by at least one solder bump to make a hybrid circuit assembly. A dielectric sealant (21) is deposited around the outside edges of sensor (11) to prevent foreign material such as encapsulating material from interfering in the operation of the sensor. The hybrid circuit assembly is encapsulated in a plastic material (14).

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Allen, Roger: "Sensors in Silicon", High Technology, Sep. 1984, pp. 43-50.
IBM Technical Disclosure Bulletin: vol. 32, No. 10B, Mar. 1990, p. 480.

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