Method of brazing columbium to itself using low bonding pressure

Details Method of brazing columbium to itself using low bonding pressure Method of brazing columbium to itself using low bonding pressure

1986-10-16

1987-11-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

Diffusion type

22826313, 22826319, 428661, B23K 104, B23K 3532

Patent

active

047052074

ABSTRACT:
The disclosure relates to a method of bonding columbium to columbium wherein a brazing foil of titanium which has been coated with either a layer of copper or a layer of nickel or layers of copper and then nickel, preferably on both sides of the foil, is disposed between the columbium sheets or the like to be joined. The columbium are placed in intimate contact with opposite sides of the foil and heated to a temperature above the eutectic point of the eutectics of the metals of the foil and no higher than about 1750.degree. F. for about 90 minutes and then cooled to provide the desired bond.

REFERENCES:
patent: 3046650 (1962-07-01), Heestand
patent: 3170234 (1965-02-01), Tarr
patent: 3214833 (1965-11-01), Erickson
patent: 3290773 (1966-12-01), Wohlberg et al.
patent: 3309767 (1967-03-01), Sama
patent: 3317288 (1967-05-01), Marshall
patent: 3594895 (1971-07-01), Hill
patent: 4034454 (1977-07-01), Galasso et al.
patent: 4448853 (1984-05-01), Fischer et al.

Affiliated with

Also associated with

Rating

Method of brazing columbium to itself using low bonding pressure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of brazing columbium to itself using low bonding pressure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of brazing columbium to itself using low bonding pressure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1062654