Method of branding a semiconductor chip package

Details Method of branding a semiconductor chip package Method of branding a semiconductor chip package

1985-07-18

1987-04-07

Crowder, Clifford D.

Printing

Antismut device

Anti-offset material application

101 35, B41F 1700

Patent

active

046551344

ABSTRACT:
A method for branding (labeling) a semiconductor chip package by warming the package prior to and subsequent to the branding resulting in a brand having greater clarity and permanency. A chip package is warmed to a temperature of about 95.degree. F. (35.degree. C.) to about 130.degree. F. (55.degree. C.) and an inked brand is applied to the warmed chip package. The branded chip package is maintained at a temperature of at least about 75.degree. F. (24.degree. C.) until the temperature is raised to a sufficient temperature to cure the branded chip package and then the branded chip package is cured.

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patent: 4073992 (1978-02-01), Lerman et al.
patent: 4270449 (1981-06-01), Ito et al.
patent: 4398457 (1983-08-01), Takahashi et al.

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