Method of bonding wafers having vias including conductive materi

Details Method of bonding wafers having vias including conductive materi Method of bonding wafers having vias including conductive materi

1995-06-05

1997-07-08

Niebling, John

Fishing, trapping, and vermin destroying

437 78, 437190, 437192, 437193, 437203, 437915, 437974, 437228, 148DIG12, 148DIG135, H01L 2128

Patent

active

056460678

ABSTRACT:
A surface mountable integrated circuit and a method of manufacture are disclosed. A wafer 110 has a die with an integrated circuit 119 in one surface of the wafer. A via 130 extends to the opposite surface. The via has a sidewall oxide 131 and is filled with a conductive material such as metal or doped polysilicon. The metal may comprise a barrier layer and an adhesion layer. The second end of the via can be fashioned as a prong 233 or a receptacle 430. Dies with vias can be stacked on top of each other or surface mounted to printed circuit boards or other substrate.

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