Method of bonding via electrorheological adhesives

Details Method of bonding via electrorheological adhesives Method of bonding via electrorheological adhesives

1988-02-24

1990-02-13

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

427 451, 427 47, B32B 3128

Patent

active

049003879

ABSTRACT:
Adhesives and coating are formulated with electrorheological materials to thicken when subjected to an electric field. The adhesives are thin and easy to apply, but thicken to prevent running while the adhesive cures or sets. A uniform bond along the joint is formed, thereby eliminating the uneven or discontinuous adhesive bonds made with conventional adhesives that reduce the strength and integrity of the joint.

REFERENCES:
patent: 2661596 (1953-12-01), Winslow
patent: 3047507 (1962-07-01), Winslow
patent: 3599428 (1971-08-01), Chaney et al.
patent: 4595445 (1986-06-01), Hombach et al.
patent: 4772407 (1988-09-01), Carlson
Sprecher, A. F., et al., Electrorheology at Small Strains and Strain Rates of Suspensions of Silica Particles in Silicone Oil, Materials Science and Engineering 95:187-197, 1987.

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