Method of bonding using an improved epoxy composition containing

Details Method of bonding using an improved epoxy composition containing Method of bonding using an improved epoxy composition containing

1977-06-17

1978-09-12

Anderson, Harold D.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

260 83, 528 99, 528110, 528111, C08G 5962

Patent

active

041135415

ABSTRACT:
An improved method of bonding is disclosed using an epoxy resin composition which incorporates a select group of chlorine-containing polyols.

REFERENCES:
patent: 2951829 (1960-09-01), Chiddix et al.
patent: 3720639 (1973-03-01), Griffith
patent: 4007079 (1977-02-01), Turley et al.
patent: 4007160 (1977-02-01), Turley

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