Method of bonding using a lignosulfonate-phenol-formaldehyde res

Details Method of bonding using a lignosulfonate-phenol-formaldehyde res Method of bonding using a lignosulfonate-phenol-formaldehyde res

1983-12-21

1985-12-17

Ball, Michael

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264109, 428506, 428528, 428534, B29J 502, C09J 328

Patent

active

045590974

ABSTRACT:
A method of manufacturing a lignosulfonate-phenol-formaldehyde resin includes heating a mixture of phenol, formaldehyde, lignosulfonate and alkali at a temperature of 60.degree. C. to 100.degree. C. and a pH of 8-13. The lignosulfonate comprises about 5 to about 80 percent of the total weight of phenol, formaldehyde and lignosulfonate and the lignosulfonate is mixed with said phenol and formaldehyde before substantial reaction between said phenol and said formaldehyde. Also disclosed are fibrous articles manufactured using this resin as a binder, such as fiberboards, particle board, plywood, oriented strand board, and waferboard.

REFERENCES:
patent: 3658638 (1972-04-01), Ludwig et al.
patent: 3790442 (1974-02-01), Ashall
patent: 3886101 (1975-05-01), Felicetta et al.
patent: 3940352 (1976-02-01), Wennerblom et al.
patent: 3956207 (1976-05-01), Blackmore et al.
patent: 4105606 (1978-08-01), Forss et al.

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