Method of bonding two objects, at least one of which comprises o

Details Method of bonding two objects, at least one of which comprises o Method of bonding two objects, at least one of which comprises o

1994-07-13

1996-12-03

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 60, 156281, 1563063, 437225, B32B 3112, H01L 21302, H01L 21461

Patent

active

055804071

ABSTRACT:
A first object, which comprises organic material, is bonded to a second object by a method whereby both objects are provided with complementary optically smooth surfaces, subsequent to which these surfaces are brought into substantial contact with one another, consequent upon which spontaneous atomic bonds are formed between atoms of the two objects. The strength of the atomic bonds thus formed can be increased by subsequently heating the region of contact of the two surfaces.

REFERENCES:
patent: 4003538 (1977-01-01), Frye
patent: 4810318 (1989-03-01), Ha-sma
patent: 4883215 (1989-11-01), Goesele
patent: 4942071 (1990-07-01), Frye
patent: 4956015 (1990-09-01), Okajima
patent: 5284803 (1994-02-01), Haisma
patent: 5421953 (1995-06-01), Nagakubo
J. Haisma et al, "Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technology Evaluations", Japanese Journal of Applied Physics, vol. 28, No. 8, Aug. 1989, pp. 1426-1443.

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