Method of bonding tungsten titanium sputter targets to titanium

Details Method of bonding tungsten titanium sputter targets to titanium Method of bonding tungsten titanium sputter targets to titanium

1993-10-27

1995-03-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Diffusion type

228155, 2282351, 228265, 22826271, 419 8, B22F 708

Patent

active

053970500

ABSTRACT:
A method of producing a sputter target assembly including a tungsten-titanium target attached to a titanium backing plate. The method includes consolidating a tungsten-titanium powder composition to form a target while simultaneously bonding the powder composition to the titanium backing plate to form an interdiffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high temperature operating capability.

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patent: 4960651 (1990-10-01), Pettigrew et al.
patent: 5215639 (1993-06-01), Boys
patent: 5230459 (1993-07-01), Mueller et al.
patent: 5234487 (1993-08-01), Wickersham, Jr. et al.

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