Metal fusion bonding – Process – Chemical reaction produces filler material in situ
Patent
1990-08-29
1991-10-08
Seidel, Richard K.
Metal fusion bonding
Process
Chemical reaction produces filler material in situ
228194, 228903, 437974, 148DIG133, 423278, B23K 2600, B23K 2000, B23K 2016
Patent
active
050546830
ABSTRACT:
A method is set forth of bonding together two bodies (1, 2), according to which a first body (1) is provided with a flat surface (5) and the second body (2) is provided with a silicon oxide layer (4) with a flat surface (6), after which a connecting layer (7) containing boron is provided on at least one of the two flat surfaces. Subsequently, the two bodies (1, 2) are pressed together at elevated temperature, so that a borosilicate glass layer is formed. According to the invention, a layer of practically pure boron is used by way of connecting layer (7). Among the advantages of this is that the composition of the borosilicate glass layer is exclusively determined by the previously chosen layer thicknesses.
REFERENCES:
patent: 3484302 (1969-12-01), Maeda et al.
patent: 3729811 (1973-05-01), Beale et al.
patent: 3909332 (1975-09-01), Yerman
Appl. Phys. Lett., "Epitaxial Film Transfer Tech . . . ", vol. 43, No. 3, Aug. 1, 1983, pp. 263-265.
Solid-State Science and Tech., "Low-Temperature Electrostatic Silicon-To-Silicon Seals . . . ", vol. 119, No. 4, Apr. 1972, pp. 545-546.
Haisma Jan
Spierings Gijsbertus
Van Den Berg Hendrik F.
Van Lierop Joseph G.
Elpel Jeanne M.
Miller Paul R.
Seidel Richard K.
U.S. Philips Corporation
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