Method of bonding Ti-alloy members

Details Method of bonding Ti-alloy members Method of bonding Ti-alloy members

1996-05-08

1997-12-23

Heinrich, Samuel M.

Metal fusion bonding

Process

Diffusion type

22826271, 148526, 219617, B23K 1301

Patent

active

056999550

ABSTRACT:
A method of firmly jointing Ti-alloy members of various shapes such as pipes and rods by solid diffusion bonding. The members are butted and heated under pressure in a non-oxidizing atmosphere, while a Ti-layer is disposed at the interface of butting by either (1) inserting a sheet for bonding made of Ti having a thickness of 500 .mu.m or less between the butted faces, or (2) previously forming a Ti-layer for bonding having a thickness of 1 .mu.m or more on at least one of the butted faces by any method such as vapor deposition.

REFERENCES:
patent: 3957194 (1976-05-01), Woodward
patent: 4043498 (1977-08-01), Conn, Jr.
patent: 5226982 (1993-07-01), Eylon

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