Metal fusion bonding – Process – Chemical reaction produces filler material in situ
Patent
1978-10-24
1980-10-21
Husar, Francis S.
Metal fusion bonding
Process
Chemical reaction produces filler material in situ
B23K 104, B23K 2500
Patent
active
042289440
ABSTRACT:
Substrates made of a metal or an alloy are bonded by coating a brazing flux incorporating a metallic powder or a metal compound powder on the surface of the substrate having a melting point of higher than 700.degree. C.; and heating them at a temperature higher than a melting point of the flux but lower than a melting point of the metal of the metallic powder or the metal compound powder whereby a molten crystallization and a mutual diffusion are caused between the substrates and the metal activated by the molten flux.
REFERENCES:
patent: 3069765 (1962-12-01), Simpelaar
patent: 3263325 (1966-08-01), Jacobson
patent: 3276113 (1966-10-01), Metcalfe
Inamura et al., "Brazing Procedure and Inspection of Contact Chip for Power Circuit Breaker", 2nd International Symposium of the Japan Welding Society.
Duvall et al., "TLP Bonding", Welding Journal, 1974 (Apr.), pp. 203-214.
Inamura Minoru
Inukai Kazuhiro
Takeuchi Noboru
Taninouchi Kentaro
Utsunomiya Shin
Husar Francis S.
Mitsubishi Denki & Kabushiki Kaisha
Ramsey K. J.
LandOfFree
Method of bonding substrates made of metal or alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of bonding substrates made of metal or alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding substrates made of metal or alloy will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2019357