Method of bonding substrates made of metal or alloy

Metal fusion bonding – Process – Chemical reaction produces filler material in situ

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B23K 104, B23K 2500

Patent

active

042289440

ABSTRACT:
Substrates made of a metal or an alloy are bonded by coating a brazing flux incorporating a metallic powder or a metal compound powder on the surface of the substrate having a melting point of higher than 700.degree. C.; and heating them at a temperature higher than a melting point of the flux but lower than a melting point of the metal of the metallic powder or the metal compound powder whereby a molten crystallization and a mutual diffusion are caused between the substrates and the metal activated by the molten flux.

REFERENCES:
patent: 3069765 (1962-12-01), Simpelaar
patent: 3263325 (1966-08-01), Jacobson
patent: 3276113 (1966-10-01), Metcalfe
Inamura et al., "Brazing Procedure and Inspection of Contact Chip for Power Circuit Breaker", 2nd International Symposium of the Japan Welding Society.
Duvall et al., "TLP Bonding", Welding Journal, 1974 (Apr.), pp. 203-214.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of bonding substrates made of metal or alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding substrates made of metal or alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding substrates made of metal or alloy will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2019357

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.