Method of bonding substrates

Details Method of bonding substrates Method of bonding substrates

2005-02-28

2008-12-23

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Manufacture of electrical device controlled printhead

Reexamination Certificate

active

07468284

ABSTRACT:
A method of bonding a first substrate to a second substrate is provided. The method comprises the steps of: (a) providing a first substrate having a plurality of etched trenches defined in a first bonding surface; (b) providing a second substrate having a second bonding surface; and (c) bonding the first bonding surface and the second bonding surface together using an adhesive. During bonding, the adhesive is received, at least partially, in the plurality of etched trenches, thereby increasing the adhesive bond strength whilst avoiding surface roughening. The method is particularly suitable for bonding semiconductor chips using liquid adhesives.

REFERENCES:
patent: 6127243 (2000-10-01), Werner et al.
patent: 6288451 (2001-09-01), Tsao
patent: 6406636 (2002-06-01), Vaganov
patent: 6410859 (2002-06-01), King
patent: 6420196 (2002-07-01), Silverbrook
patent: 6433390 (2002-08-01), Hara
patent: 2003/0116276 (2003-06-01), Weldon et al.
patent: 2003/0209314 (2003-11-01), Guo et al.
patent: 2004/0011761 (2004-01-01), Dewa
patent: 2004/0092804 (2004-05-01), Rayssac
patent: 2005/0029222 (2005-02-01), Chen
Y. Jin, “MEMS Vacuum Packaging Technology and Applications” 2003 IEEE Electronics Packaging Technology Conference, p. 301-304.
Wolf, Stanley “Silicon Processing for the VLSI Era: vol. 1 Process Technology” 2nd ed. 2000 pp. 489.

Affiliated with

Also associated with

Rating

Method of bonding substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4042684