Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-09-10
1995-01-24
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562739, 156281, 437921, 437974, 437225, 148DIG12, 148DIG159, 148DIG135, H01L 2120, H01L 2102
Patent
active
053839935
ABSTRACT:
In a method of bonding semiconductor substrates, a plurality of the semiconductor substrates are first prepared. Surfaces of the semiconductor substrates are mirror-polished. The mirror-polished surface of at least one of the semiconductor substrates is then provided with a hydrophilic property in such a way that an oxide layer is formed on the mirror-polished surface by exposing the mirror-polished surface to an atmosphere of at least one of an oxygen ion and an oxygen radical. A water molecule is then adhered to the mirror-polished surface. The semiconductor substrates then contact with each other through the mirror-polished surface. The contacted semiconductor substrates are then heated. According to such a method of bonding, the semiconductor substrates are strongly bonded to each other with hardly an unbonded region even if the semiconductor substrates are heated at a low temperature.
REFERENCES:
patent: 3506424 (1970-04-01), Pomerantz
patent: 4501060 (1985-02-01), Frye et al.
patent: 4774196 (1988-09-01), Blanchard
patent: 4810318 (1989-03-01), Haisma et al.
patent: 4944754 (1990-07-01), Linkow et al.
patent: 4983251 (1991-01-01), Haisma et al.
patent: 5169472 (1992-12-01), Goebel
Lasky, J. B., "Wafer Bonding for Silicon-on-Insulator Technologies", Appl. Phys. Lett. 48(1), 6 Jan. 1986, pp. 78-80.
Fujino Seiji
Katada Mitsutaka
Onoda Michitoshi
Tsuruta Kazuhiro
Aftergut Jeff H.
Nippon Soken Inc.
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