Method of bonding semiconductor devices to heatsinks

Details Method of bonding semiconductor devices to heatsinks Method of bonding semiconductor devices to heatsinks

1984-05-14

1986-03-18

Schmidt, Frederick R.

Metal fusion bonding

Process

With shaping

2281733, 228188, 228205, 29 90R, 51235, B21D 3900, B23K 3102, B23K 120

Patent

active

045763267

ABSTRACT:
A method for matching the bonding pad surfaces of a device and heatsinks to be bonded, which method maximizes the uniformity of pressure applied during thermocompression bonding, is disclosed. The method comprises using the collet of a die bonding machine to burnish the bonding pad on a heatsink. The collet is then traversed to a second workstage where the collet is used to pick up a device and burnish the device bonding pad against a suitable burnishing medium. The collet, with the device, is then traversed back to the main workstage where thermocompression bonding of the device to the heatsink is carried out. The alignment of the collet is locked and maintained throughout all of the steps to insure that all burnished surfaces are parallel and that the pressure during bonding is perfectly perpendicular to those parallel surfaces.

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Copending application "Method of Burnishing Malleable Films on Semiconductor Substrates" by F. Z. Hawrylo filed concurrently herewith.

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