Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2010-02-24
2011-10-04
Garber, Charles (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S021000, C438S025000, C438S026000, C438S051000, C438S055000, C257SE21499
Reexamination Certificate
active
08030175
ABSTRACT:
A method of bonding an integrated circuit to an adhesive substrate. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method includes the steps of: (a) selecting one of the integrated circuits for bonding to the adhesive substrate; (b) positioning the adhesive substrate at a backside of the selected integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the selected integrated circuit; and (d) applying a bonding force from the bonding tool through the film frame tape and the selected integrated circuit onto the adhesive substrate, so as to bond the backside of the selected integrated circuit to the substrate.
REFERENCES:
patent: 5476566 (1995-12-01), Cavasin
patent: 6425971 (2002-07-01), Silverbrook
patent: 2004/0020037 (2004-02-01), Arneson et al.
patent: 2007/0014920 (2007-01-01), Syms
patent: 2008/0242052 (2008-10-01), Feng et al.
Foote Roger Mervyn Lloyd
Silverbrook Kia
Garber Charles
Mustapha Abdulfattah
Silverbrook Research Pty Ltd
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