Method of bonding polyimide films and printed circuit boards inc

Details Method of bonding polyimide films and printed circuit boards inc Method of bonding polyimide films and printed circuit boards inc

1991-05-20

1993-01-05

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563315, 174259, 4284735, 525490, 528163, C09J 502

Patent

active

051767805

ABSTRACT:
An adhesive having a content of a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule, optionally in combination with at least one curable epoxy compound, is used for bonding polyimide films to films of the same kind or to other substrates, particularly metal foils. Such bondings are highly heat-resistant and have an excellent peeling resistance. Therefore, they are suitable for the manufacture of printed circuit boards having high thermal stability and peeling resistance.

REFERENCES:
patent: 4278733 (1981-07-01), Benzinger
patent: 5021484 (1991-06-01), Schreiber et al.
patent: 5044074 (1991-09-01), Hadwiger et al.

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