Method of bonding particle board and the like using polyisocyana

Details Method of bonding particle board and the like using polyisocyana Method of bonding particle board and the like using polyisocyana

1978-12-19

1980-06-24

Pertilla, Theodore E.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

156 622, 264109, 264128, 525504, C08L 6110

Patent

active

042094330

ABSTRACT:
A method of forming particle board characterized by the use of an adhesive comprising a polyisocyanate and a phenolic adhesive. Enhanced adhesive characteristics and other advantages are associated with the method in which the polyisocyanate is added to the wood particles, etc. prior to application of the phenolic adhesive.

REFERENCES:
patent: 3636199 (1972-01-01), Jenks et al.
patent: 3903041 (1975-09-01), Bornstein
patent: 3919017 (1975-11-01), Shoemaker
patent: 4086125 (1978-04-01), Vasishth et al.

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