Method of bonding microelectronic chips

Details Method of bonding microelectronic chips Method of bonding microelectronic chips

1978-01-27

1979-03-06

Lanham, C.W.

Metal fusion bonding

Process

Using high frequency vibratory energy

228123, 228253, 156 731, 156233, B23K 102, H01L 2158

Patent

active

041426622

ABSTRACT:
Disclosed is a method of bonding microelectronic chips to bonding surfaces utilizing thin, soft bonding material preforms. The bonding material, such as indium, is formed on a carrier strip. A portion of the material is transferred from the strip by bringing it in contact with the bonding surface and supplying pressure to the strip. The chip may then be bonded to the coated surface.

REFERENCES:
patent: 3470611 (1969-10-01), McIver et al.
patent: 3513013 (1970-05-01), Willis et al.
patent: 3781978 (1974-01-01), Intrator et al.
Herdzik et al., "Tinning Preplated Sites on a Substrate", IBM Technical Disclosure Bulletin, vol. 19, No. 8 (Jan. 1977), p. 3049.
Immendorfer, "Preparing Printed Circuits", IBM Technical Disclosure Bulletin, vol. 4, No. 12 (May 1962), p. 18.

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