Method of bonding metals with a radio-opaque adhesive/sealant fo

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156 64, 156330, 1563317, 228104, 428328, 428418, 428460, 428461, 428469, B05D 300, B32B 3124

Patent

active

049406337

ABSTRACT:
A method and structure for providing radio-opaque polymer compounds for use in metal bonding and sealing. A powder filler comprising a high atomic number metal or compound thereof is incorporated into a polymer compound to render it more radio-opaque than the surrounding metal structures. Voids or other discontinuities in the radio-opaque polymer compound can then be detected by x-ray inspection or other non-destructive radiographic procedure.

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