Method of bonding metals to ceramics

Details Method of bonding metals to ceramics Method of bonding metals to ceramics

1990-08-14

1992-01-07

Nguyen, Nam X.

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

20419217, 20419231, 505706, C23C 1434

Patent

active

050792237

ABSTRACT:
A method of forming a composite by providing a ceramic capable of having zero electrical resistance and complete diamagnetism at superconducting temperatures, bonding a thin layer of Ag, Au or alloys thereof with the ceramic. Thereafter, there is bonded a first metal to the ceramic surface at a temperature less than about 400.degree. C., and then a second metal is bonded to the first metal at a temperature less than about 400.degree. C. to form a composite wherein the first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Ti and alloys thereof and wherein the second metal is selected from the class consisting of Al, Cu, Pb and Zn and alloys thereof.

REFERENCES:
patent: 3761309 (1973-09-01), Schmitter et al.
patent: 4337133 (1982-06-01), Augis et al.
patent: 4464422 (1984-08-01), Senda et al.
patent: 4963523 (1990-10-01), Ekin et al.
Ekin et al., "Effect . . . Contacts", Material Res. Soc. Sym. Proc., vol. 99, 1988.
Ginley et al., "Grain . . . System", Mat. Res. Soc. Proceedings of Syn. S., 1987.

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