Method of bonding metal to a non-metal substrate

Details Method of bonding metal to a non-metal substrate Method of bonding metal to a non-metal substrate

1994-10-06

1996-12-24

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

21912164, B23K 2600

Patent

active

055867146

ABSTRACT:
A method of bonding metal to a non-metal substrate. The process includes placing the metal in contact with a non-metal substrate and blanketing the contact region with a gaseous atmosphere in which the amount of reactive gas is limited to minimize oxidation of the metal at the surface. Heating of the metal is accomplished by various means including a laser beam. The metal is heated to a point where the reactive gas and metal form a eutectic that wets the contact area between the metal and non-metallic substrate. Upon cooling, the metal and non-metallic substrate are bonded together over a substantial part of the contact area.

REFERENCES:
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4849292 (1989-07-01), Mizunoya et al.
patent: 5280850 (1994-01-01), Horiguchi et al.

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