Joints and connections – Utilizing thermal characteristic – e.g. – expansion or... – Interposed material of intermediate coefficient of expansion
Patent
1990-04-05
1992-11-17
Reese, Randolph A.
Joints and connections
Utilizing thermal characteristic, e.g., expansion or...
Interposed material of intermediate coefficient of expansion
403 30, 403270, 428450, 228124, 228125, 22826312, F16C 900, B32B 906, B23K 3100
Patent
active
051637707
ABSTRACT:
A method of bonding at least two members having different coefficients of thermal expansion is disclosed, wherein an edge of a bonding interface between the members is positioned in a tapered portion, thereby bridging one member having a smaller coefficient of thermal expansion and another having a larger coefficient of thermal expansion. A bonded composite article comprising such bonded members having the different coefficients of thermal expansion is also disclosed.
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Soma Takao
Yoshida Akihiko
McBee J. Russell
NGK Insulators Ltd.
Reese Randolph A.
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