Method of bonding leads to semiconductor elements

Details Method of bonding leads to semiconductor elements Method of bonding leads to semiconductor elements

1991-03-14

1992-03-10

Seidel, Richard K.

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281802, 29834, H05K 332, H01L 2160

Patent

active

050943820

ABSTRACT:
A method for sequentially bonding semiconductor elements to leads formed on TAB type carrier is disclosed. The method provides for the use of the difference between pre and post bonding position recognition values to correct relative pre-positioning of leads and electrodes in successive bonding cycles by sequential learning and thereby obtain improved correction of position slippages between leads and electrodes during bonding.

REFERENCES:
patent: 4342090 (1982-07-01), Caccoma et al.
"Automatic Semiconductor Chip Electrical Test Probe Alignment System," IBM Tech. Disclosure Bulletin, vol. 29, No. 6 (11/1986) pp. 2626-2627.

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