Method of bonding inner leads to chip pads

Details Method of bonding inner leads to chip pads Method of bonding inner leads to chip pads

2005-05-31

2005-05-31

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S740000, C029S835000, C029S843000, C029S844000, C228S180500

Reexamination Certificate

active

06898848

ABSTRACT:
A chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the ape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized and the center line of the inner lead is recognized. The inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S. the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

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Semiconductor World, May 1995, pp. 112-113.

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