Method of bonding gold films to non-electrically conducting oxid

Stock material or miscellaneous articles – Composite – Of metal

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75165, 427124, 427125, 428538, B32B 1504

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active

040668193

ABSTRACT:
A microstrip board comprising a gold film which contains about at least 1/2 weight per cent of aluminum bonded to a non-electrical conducting oxide is prepared by simultaneously evaporating the gold and aluminum onto the non-electrical conducting oxide and thereafter optionally heating the film thus formed.

REFERENCES:
patent: 2450851 (1948-10-01), Colbert et al.
patent: 2842463 (1958-07-01), Bond et al.
patent: 3326720 (1967-06-01), Bruhl, Jr. et al.
patent: 3356982 (1967-12-01), Solow
patent: 3769006 (1973-10-01), Ingersoll
Brennan et al., Effect of Nature of Surfaces on Wetting of Sapphire by Lid Aluminum, In. J. of Am. Ceramic Soc., 51(10): p. 596, 1968.

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