Method of bonding flying leads

Details Method of bonding flying leads Method of bonding flying leads

2008-05-06

2008-05-06

Till, Terrence R. (Department: 4175)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603040, C029S603060, C360S244300, C228S110100

Reexamination Certificate

active

11391362

ABSTRACT:
A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.

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