Method of bonding display substrates by application of an...

Details Method of bonding display substrates by application of an... Method of bonding display substrates by application of an...

2007-12-04

2007-12-04

Santiago, Mariceli (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

C445S024000, C065S036000, C065S040000, C065S058000

Reexamination Certificate

active

11510643

ABSTRACT:
After sealing layers are formed on peripheral edge parts of a front substrate and a rear substrate, the front substrate and the rear substrate are disposed to be opposed to each other. Current paths are formed in the sealing layers, and power supply is begun. An electric current, which reaches a maximum current value after a current-increasing period of 10% or more of an entire power-supply time, is supplied for a perdetermined time period. The sealing layers are heated and melted by the power supply, and peripheral parts of the front substrate and rear substrate are joined.

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