Method of bonding copper and a substrate for power electronics a

Details Method of bonding copper and a substrate for power electronics a Method of bonding copper and a substrate for power electronics a

1993-06-25

1995-12-05

Hoang, Tu

Electric heating

Metal heating

By arc

2191216, 21912169, 228173, B23K 2600

Patent

active

054731372

ABSTRACT:
A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method including the steps of oxidizing the surface of the substrate and then directly bonding copper to the oxidized surface of the substrate, wherein the step of oxidizing the surface of the substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.

REFERENCES:
patent: 3596045 (1971-07-01), Stiegerwald
patent: 3911553 (1975-10-01), Burgess et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4457958 (1984-07-01), Lange et al.
patent: 4769310 (1988-09-01), Gugger et al.
Patent Abstracts of Japan, vol. 10, No. 164 (E-410) Jun. 11, 1986 & JP-A-61 16 530 (Matsushita Densi Kogyo KK) Jan. 24, 1986.

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