Method of bonding connecting pins to the eyelets of conductors f

Details Method of bonding connecting pins to the eyelets of conductors f Method of bonding connecting pins to the eyelets of conductors f

1982-12-23

1984-07-31

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228246, B23K 302

Patent

active

044625340

ABSTRACT:
This method of bonding the heads of connecting pins previously inserted in a ceramic substrate to the eyelets of conductors formed on the top surface of said substrate comprises the steps of: applying a droplet of flux to the head of each pin; applying a solder ball to the head of each pin where it is held in position because of the adhesive capacity of the flux; heating in a furnace containing a nitrogen atmosphere and having a peak temperature of 350.degree. C. to cause a solder reflow; and allowing to cool to enable the solder to set and to provide a permanent electrical and mechanical bond between the head of the pins and the eyelets. This method is suitable for use in manufacturing electronic modules employed in computers.

REFERENCES:
patent: 3292240 (1966-12-01), McNutt et al.
patent: 3719981 (1973-03-01), Steitz
patent: 4332341 (1982-06-01), Minetti
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4421266 (1983-12-01), Boch

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