Metal fusion bonding – Process – Plural joints
Patent
1986-02-24
1988-01-05
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228 45, B23K 3102
Patent
active
047170662
ABSTRACT:
Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.
REFERENCES:
patent: 4330329 (1982-05-01), Hayashi
patent: 4434347 (1984-02-01), Kurtz
Goldenberg Tsvi
Greenberg Lawrence A.
Moll Kenneth P.
American Telephone and Telegraph Company AT&T Bell Laboratories
Birnbaum Lester H.
Godici Nicholas P.
Reid G.
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