Method of bonding columbium to titanium and titanium based alloy

Details Method of bonding columbium to titanium and titanium based alloy Method of bonding columbium to titanium and titanium based alloy

1986-11-10

1987-12-29

Godici, Nicholas P.

Metal fusion bonding

Process

Diffusion type

22826321, B23K 2000, B23K 2016, B23K 2022

Patent

active

047155256

ABSTRACT:
The disclosure relates to a method of joining titanium and titanium based alloys to columbium at low pressure and low temperature, wherein a titanium foil is electroplated with layers of copper and nickel with a columbium sheet then being placed in intimate contact with the exposed layer. The materials are then heated in a vacuum to a temperature above the Ti-Cu-Ni eutectic temperature and below the beta-transus of the titanium material to provide a joining of titanium to columbium without materially altering the mechanical properties of the materials involved.

REFERENCES:
patent: 4026677 (1977-05-01), Galasso et al.
patent: 4034454 (1977-07-01), Galasso et al.
patent: 4034906 (1977-07-01), Carlson et al.

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