Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-03-25
1996-08-13
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562755, 1562757, 156330, 29830, 29832, 29840, B32B 3112, B32B 3120, B32B 3128, H05K 330
Patent
active
055452817
ABSTRACT:
An integrated circuit connecting method that includes connecting electrode pads on an integrated circuit device to electrode terminals on a base with metal bumps interposed, the electrode terminals being formed in registry with the electrode pads. The method includes the steps of forming metal bumps on a surface of at least one of the electrode pads and the electrode terminals; covering the surface on at least one of the integrated circuit device side and the base side with a resin that cures upon exposure to active energy rays; patterning the resin to strip selectively the coating of the resin over one of the electrode pads and the electrode terminals; bringing the electrode pads and the electrode terminals into a face-to-face relationship, allowing the metal bumps to contact one of the opposing electrode pads and electrode terminals, performing thermocompressing so that the resin coating will adhere closely to one of the integrated circuit device and the base while, at the same time, the electrode pads are connected to the electrode terminals with the metal bumps interposed; and performing at least one of heat treatment and exposure to active energy rays.
REFERENCES:
patent: 3706915 (1972-12-01), Lootens et al.
patent: 5071787 (1991-12-01), Mori et al.
patent: 5074947 (1991-12-01), Estes et al.
Aoyama Toshimi
Kimura Mitsuru
Komano Hiroshi
Matsui Koji
Ogawa Eiichi
Mayes M. Curtis
NEC Corporation
Simmons David A.
Tokyo Ohka Kogyo Co. Ltd.
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