Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-11-19
1994-06-07
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1562733, 1562755, 1562757, 156320, 29830, B32B 3100
Patent
active
053186516
ABSTRACT:
A method of bonding first and second circuit boards includes applying a light-sensitive adhesive over the first electrodes on a first circuit board and the areas where the first electrodes are not formed, and drying the applied adhesive to form a light-sensitive adhesive layer having the light-sensitive adhesive layer exposed selectively to active rays of light and performing development to remove only the light-sensitive adhesive layer on the first electrodes, and then performing a heat treatment to impart bonding quality to the light-sensitive adhesive layer remaining between adjacent first electrodes, placing the first and second circuit boards one on top of the other and thermocompressing the two circuit boards to have the first electrodes connected electrically to the second electrodes to form a single circuit board; and performing a heat treatment and/or exposure to active rays of light on the formed single circuit board.
REFERENCES:
patent: 4157407 (1979-06-01), Peiffer
patent: 4536468 (1985-08-01), Yasui et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4759490 (1988-06-01), Ochiai
patent: 4880486 (1989-11-01), Maeda
patent: 4916805 (1990-04-01), Ellrich et al.
patent: 4935627 (1990-06-01), Zimmermann et al.
patent: 4948706 (1990-08-01), Sugihara et al.
patent: 5065505 (1991-11-01), Matsubara et al.
IBM Technical Disclosure Bulletin, vol. 26, No. 3A, Aug. 1983; Plug and Socket Chip Joining by Jones et al.
Aoyama Toshimi
Kimura Mitsuru
Komano Hiroshi
Matsui Koji
Ogawa Eiichi
Mayer M. Curtis
NEC Corporation
Simmons David A.
Tokyo Ohka Kogyo Co. Ltd.
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