Method of bonding by anodic bonding for field emission display

Details Method of bonding by anodic bonding for field emission display Method of bonding by anodic bonding for field emission display

2005-03-08

2005-03-08

Williams, Joseph (Department: 2879)

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

C445S023000, C445S025000, C219S602000, C219S603000, C029S603110

Reexamination Certificate

active

06863585

ABSTRACT:
A method of bonding spacers to an anode plate of a field emission display. An anode plate having separate phosphor regions is provided, wherein a black matrix material is provided to separate the phosphor regions from one another. A magnetic layer is formed on the black matrix material. A thin metal film is formed on the anode plate and the magnetic layer. Spacers are disposed on the metal film above the black matrix material. An electromagnetic induction procedure is performed to heat the magnetic layer and thus serves as a heating source to produce heat, wherein the heat goes through the metal film to heat the spacers. A direct current (D.C.) electric field procedure is performed to bond the spacers to the metal film above the black matrix material.

REFERENCES:
patent: 6429582 (2002-08-01), Watkins et al.
patent: 6722936 (2004-04-01), Hammel

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