Method of bonding an external lead and a tool therefor

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1563809, 156497, 156498, 156311, 21912164, 21912184, 228118, 228 46, 2281801, 228200, B32B 3100

Patent

active

054626269

ABSTRACT:
A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.

REFERENCES:
patent: 3605244 (1971-09-01), Osborne et al.
patent: 4489487 (1984-12-01), Bura
patent: 4684055 (1987-08-01), Baer et al.
patent: 4970365 (1990-11-01), Chalco
patent: 5019201 (1991-05-01), Yabu et al.
patent: 5194710 (1993-03-01), McDaniel et al.
patent: 5227604 (1993-07-01), Freedman
patent: 5234105 (1993-08-01), Sato et al.
patent: 5276298 (1994-01-01), Jones et al.
patent: 5289966 (1994-03-01), Izumi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of bonding an external lead and a tool therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding an external lead and a tool therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding an external lead and a tool therefor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1769713

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.