Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1983-05-16
1984-07-10
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
106 113, 106 114, 106285, 106290, 156325, 252514, 357 67, 357 75, 361400, 361411, 428208, 428209, 428210, 428448, 501 19, 501 20, 501 22, 501 75, 501 76, B32B 3104, C03C 310, H05K 706, H01L 2310
Patent
active
044591667
ABSTRACT:
A silver metallizing paste for attachment of silicon semi-conductive devices in lead-frame packages, specifically ceramic packages, which is less expensive than a gold preform but useable in hermetic packages, and provides better electrical and thermal conductivity, and higher bond strength, than silver polyimides. From 25 to 95% of silver is blended with a low-melting glass, preferably one having 95-96% PbO, and a paste or ink is formed with a suitable vehicle at 75-85% solids. Use of the paste follows conventional practice. Selection of Ag:glass ratio depends on the type of die bonding to be used. The paste is particularly useful in MOS technology, where low contact resistance is required, and also finds applications as a solder substitute and bonding chip capacitors. It is most advantageous in attachment of larger-area integrated circuits in that stress cracking associated with the gold-silicon eutectic is avoided.
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Dietz Raymond L.
Featherby Michael
Margetts Peter K.
Burke II James J.
Johnson Matthey Inc.
Weston Caleb
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