Method of bonding adherend

Details Method of bonding adherend Method of bonding adherend

2007-02-27

2007-02-27

Peng, Kuo-Liang (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C528S901000, C525S404000, C525S476000

Reexamination Certificate

active

10258391

ABSTRACT:
By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.

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