Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2005-10-04
2005-10-04
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C219S678000
Reexamination Certificate
active
06951798
ABSTRACT:
A method of bonding multiple layers is provided. The method includes the steps of stacking the multiple layers on top of each other and volumetrically heating the stack of multiple layers to a predetermined temperature. It is preferred that the stack is heated by electromagnetic induction.
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Booske John H.
Cooper Reid F.
Gianchandani Yogesh B.
Thompson Keith J.
Boyle Fredrickson Newholm Stein & Gratz S.C.
Geyer Scott
Lebentritt Michael
Wisconsin Alumni Research Foundation
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