Method of bonding a sputtering target to a backing plate

Details Method of bonding a sputtering target to a backing plate Method of bonding a sputtering target to a backing plate

1999-07-08

2000-12-26

Ryan, Patrick

Metal fusion bonding

Process

Using explosive energy

228160, B23K 2008

Patent

active

061645192

ABSTRACT:
There is provided a method of forming a high strength atomic bond between a sputter target and backing plate such that the microstructural characteristics of the sputter target material obtained by prior processing is not altered by the bonding process. There is further provided a method for bonding the target to the backing plate and forming a bonded target/backing plate assembly having a greater target thickness for increased sputtering life, while maintaining the overall standard dimensions set by industry standards.

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