Method of bonding a sheet of metal, such as copper, on an alumin

Details Method of bonding a sheet of metal, such as copper, on an alumin Method of bonding a sheet of metal, such as copper, on an alumin

1991-02-20

1992-09-29

Rowan, Kurt

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

156281, 156325, 148285, 228211, 427377, B23K 120, C23C 812

Patent

active

051508303

ABSTRACT:
A method of bonding a sheet of metal such as copper on a substrate of aluminum nitride, the method comprising the following steps known per se: i) growing a layer of alumina on the aluminum nitride substrate by means of heat treatment; and ii) placing the sheet of metal on the alumina layer and then bonding them together; the method being wherein alumina-growing step i) is performed under a controlled oxidizing atmosphere which is free from moisture.

REFERENCES:
patent: 2754456 (1956-07-01), Madelung
patent: 4542073 (1985-09-01), Tanaka et al.
patent: 4693409 (1987-09-01), Mizunoya et al.
patent: 4860939 (1989-08-01), Guinet et al.
A. Schmitt, "Method of Producing Silicon Dioxide Layers with Uniform Thickness", IBM Tech. Disc. Bull., vol. 23, No. 9, Feb. 1981.
Proceedings of the Hybrid Microelectronics Conference, May 1989, Hamburg, pp. 1-8; Y. Kuromitsu et al.; "Surface Treatment of A1N Substrate".
Chemical Abstracts, vol. 108, No. 14, Apr. 1988, Columbus, Ohio U.S.A. Y. Kurihara et al.: "Metallized Aluminum Nitride Sintered Body and its Manufacture", Ref. No. 117638D.
Annales De Chimi Francais, vol. 10, 1985, pp. 79-83, S. Yefsah et al.: "Comportement dans la vapeur d'eau a haute temperature du nitrure d'aluminium".

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