Method of bonding a semiconductor wafer

Details Method of bonding a semiconductor wafer Method of bonding a semiconductor wafer

1995-01-03

2000-09-05

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156281, 438455, B32B 3100, H01L 2146

Patent

active

061137219

ABSTRACT:
Removing a portion of an active wafer (12) at the edge (18) after the active wafer (12) is bonded to a base wafer (10) prevents chipping of the edge of the active wafer during thinning of the active wafer (12). Grinding and polishing of the edges of the active wafer (12) is preferably performed.

REFERENCES:
patent: 3567547 (1971-03-01), Mattson et al.
patent: 5087307 (1992-02-01), Nomura et al.
patent: 5097630 (1992-03-01), Maeda et al.
patent: 5152857 (1992-10-01), Ito et al.
patent: 5274959 (1994-01-01), Dyer et al.
patent: 5340435 (1994-08-01), Ito et al.
Webster's New Collegiate Dictionary, G & C Merriam Company, Springfield, MA, 1977, p. 647.

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