Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1988-03-30
1989-10-03
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156315, 357 80, C09J 504
Patent
active
048714054
ABSTRACT:
A semiconductor device comprising a semiconductor element, a support member for supporting the semiconductor element on the support member. The bonding layer comprises element and a bonding layer for bonding the semiconductor a hard layer of a high-viscosity bonding agent which has a high viscosity before curing and which has an irregular free surface defining projections and cavities, and a soft layer of a low-viscosity bonding agent which has a low viscosity before curing and disposed within the cavities in the irregular free surface of the hard layer to fill them. The hard layer defining a portion of the bonding surfaces and the soft layer defining the remaining portion of the bonding surface provide a continuous hybrid bonding surface for the bonding layer. A process for bonding a semiconductor element to a support member is also disclosed.
REFERENCES:
patent: 3475867 (1969-11-01), Walsh
patent: 4175145 (1979-11-01), Fechter
patent: 4190855 (1980-02-01), Inoue
patent: 4209358 (1980-06-01), DiLeo et al.
patent: 4377619 (1983-03-01), Schonhorn et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4741926 (1988-05-01), White et al.
patent: 4745018 (1988-05-01), Chihara et al.
Tower et al, "Design and Performance . . . Focal Planes", RCA Review, vol. 47, Jun. 1986, pp. 226-255.
Bolger et al, "Failure Mechanisms . . . Encapsulated I.C.'s", IEEE 1983, pp. 227-231.
Bolger et al., "Die Attach in . . . Polyimides", IEEE 1984, pp. 63-67.
Ball Michael W.
Director General Agency of Industrial Science and Technology
Maki Steven D.
LandOfFree
Method of bonding a semiconductor to a package with a low and hi does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of bonding a semiconductor to a package with a low and hi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding a semiconductor to a package with a low and hi will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-662066