Method of bonding a semiconductor element to a substrate

Details Method of bonding a semiconductor element to a substrate Method of bonding a semiconductor element to a substrate

2005-04-19

2005-04-19

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S113000, C438S612000, C438S613000

Reexamination Certificate

active

06881612

ABSTRACT:
A conductive member is provided on each of electrodes of a semiconductor element. The conductive member is pressed into a shape having a height of approximately two-thirds of the original height to provide a bump. The semiconductor element is caused to face a substrate having an interconnecting pattern with an interposed adhesive containing an insulating filler. At least one of the semiconductor element and the substrate is pressed to electrically connect the bumps to the interconnecting pattern.

REFERENCES:
patent: 5633204 (1997-05-01), Tago et al.
patent: 5952718 (1999-09-01), Ohtsuka et al.
patent: 5976964 (1999-11-01), Ball
patent: 6207473 (2001-03-01), Hirai et al.
patent: 6232563 (2001-05-01), Kim et al.
patent: 6267650 (2001-07-01), Hembree
patent: 6282780 (2001-09-01), Waki et al.
patent: 6468832 (2002-10-01), Mostafazadeh
patent: 10-032224 (1998-02-01), None

Affiliated with

Also associated with

Rating

Method of bonding a semiconductor element to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding a semiconductor element to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding a semiconductor element to a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3370248