Method of bonding a semiconductor die to a package using a gold/

Details Method of bonding a semiconductor die to a package using a gold/ Method of bonding a semiconductor die to a package using a gold/

1991-12-20

1993-02-23

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437248, 437926, 29740, 29840, 228123, 228254, 228231, 228232, 228200, 432 18, 432 77, H01L 2152, H01L 2158, H01L, H01L, H01L 21607

Patent

active

051889820

ABSTRACT:
An Au/si die attach method for attaching a die to a package including preheating the package, melting an Au/Si preform in the package cavity, scratching the die onto the package cavity to form a die attach bond, and gradually cooling an Au/Si die bond by reducing heat supplied to the package, so as to cool the package through a monotonically decreasing sequence of temperatures, wherein the package is maintained for a predetermined period of time at each temperature in the sequence.
A heating block with segments supplies a decreasing amount of heat to the packages to let the die attached bond gradually cool. The packages are kept on top of the segments of the heating block for a predetermined period of time and each segment is heated to a specific temperature. The gradual cooling of the die attach bond decreases the thermal resistance and prevents the creation of voids in the die attach bond.

REFERENCES:
patent: 4771018 (1988-09-01), Bhattacharyya et al.
patent: 4810671 (1989-03-01), Bhattacharyya et al.
Mahalingam, M. et al., "Thermal Effect of Die Bond Voids," Semiconductor International, Sep. 1984, pp. 71-79.
Huang, C. C. and N. K. Sharma, "Thermal Enhancement Methods for ECL Gate Array Packaging," IEEE Semiconductor Thermal and Temperature Measurement Symposium, Proceedings 1988, pp. 78-83.

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