Method of bonding a semiconductor device with a substrate

Details Method of bonding a semiconductor device with a substrate Method of bonding a semiconductor device with a substrate

1990-03-07

1991-09-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29740, 228 51, 228 53, 2281802, H05K 334, B23P 1900

Patent

active

050481800

ABSTRACT:
An improved tape automated bonding is disclosed. A heater head employs a heat conducting member and a bonding tip member. The heat conducting member formed of a material, such as molybdenum or tungsten, has a U-shaped contour which comprises a pair of halves and an interconnection for generating bonding heat by undergoing high frequency electric current. The bonding tip member is bonded to the interconnection of the conducting member. The tip member is formed of material, such as diamond or cubic boron nitride, which is higher in resistivity and thermal conductivity than the conducting member.

REFERENCES:
patent: 2501616 (1950-03-01), Robinson
patent: 2679223 (1954-05-01), Franklin
patent: 3080842 (1963-03-01), Rice
patent: 3576969 (1971-05-01), Surty et al.
patent: 4667867 (1987-05-01), Dobbs et al.
patent: 4871899 (1989-10-01), Du Frenne
Research Disclosure, Feb. 1988, No. 28657, p. 100.

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